POSEICO S.p.A. POwer SEmiconductors Italian COrporation

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Mounting recommendations

In the assembling of Power Semiconductors, in order to ensure effective cooling, good current conduction and reliability, it's important to observe some recommendations particularly regarding heatsink preparation and clamping system. The recommended procedure for assembling the components is as follows:

Using BAR clamping system

clean the mounting area^a of both heatsink with "abrasive rubber" and after with alcohol.

clean the mounting surfaces of the semiconductor with alcohol

apply a thin film of mounting grease^b on both the mounting surfaces of the heatsink.

position the semiconductor between the two heatsinks and rotate it to spread the contact grease.
CAUTION: Each guide pin should be located in the center hole.

pre-assemble the clamp housing if necessary.

place the pre-assembled portion of the clamp through the heatsink and the semiconductor assembly.

place over the upper heatsink the second part of the clamp, equipped with its spring system and hardware parts.

tighten by "fingers"the screw and put in position all the assembly.
CAUTION: all the surfaces must be parallel before tightening

tighten the screws half a turn until the pressure indicating systems shows that the required pressure has been achieved.

Using BOX clamping system

clean the mounting area^a of both heatsink with "abrasive rubber" and after with alcohol.

clean the mounting surfaces of the semiconductor with alcohol

apply a thin film of mounting grease^b on both the mounting surfaces of the heatsink.

position the box clamp over the device ensuring that the pins are correctly located

position the square steel plate over the central rod, putting bolts through the clamp whilst holding it firmly in place.

screw the bolts "finger thight" then alternatively, clockwise, half a turn until the box toches the heatsink all the way round.
CAUTION: Use anyway a torque wrench to apply the right clamping force.

a) recommended machine tolerances over the device area: flatness 30 micron, roughness 2 micron.
b) recommended mounting grease - CONTACTAL HPG.

NOTE: BEFORE MOUNTING INTO EQUIPMENT THE ASSEMBLY MUST BE TESTED BY "LEAKAGE" TEST TO VERIFY THE ELECTRICAL INTEGRITY.

Sede Legale: Via Macaggi 23/3, 16121 Genova - REG.IMP., C.F. e P.IVA 03856630102 - Capitale sociale € 621.000 i.v. - CCIAA GE - Num. R.E.A. 384995
Content © 2007 - 2009 POSEICO S.p.A. POwer SEmiconductors Italian COrporation